With the progress of "Made in China 2025", the semiconductor equipment required by living facilities and industrial equipment is developing rapidly, and its power consumption, high-scale integration and modularization, high safety factor, and sensitive operation, so the need for it The preparation of high thermal conductivity materials is still an urgent problem to be solved so far.
To solve this problem, diamond, cubic boron nitride, silicon nitride, beryllium nitride, and aluminum nitride can be used. However, the synthesis of diamond and cubic boron nitride is a complicated and expensive process; silicon nitride semiconductors have poor high-frequency performance; beryllium nitride is a toxic substance. However, ceramics with aluminum nitride as the base material have the most suitable comprehensive properties. And after various experiments, it has slowly appeared in people's field of vision, among which the largest application field is high-power LED products.
Aluminum nitride ceramic circuit board as the main path of heat flow is indispensable in high-power LED packaging applications. It plays a very important role in improving the heat dissipation efficiency of the device, reducing the junction temperature, and improving the reliability and life of the device. .
LED heat dissipation circuit boards are mainly divided into: LED die circuit boards and system circuit boards. The LED chip circuit board is mainly used as a medium for heat energy extraction between the LED chip and the system circuit board, and is combined with the LED chip through the process of wire bonding, eutectic or flip chip. With the development of high-power LEDs, circuit boards based on heat dissipation are mostly ceramic circuit boards: There are three main methods for preparing traditional high-power circuits:
1. Thick film ceramic plate
2. Low-temperature co-fired multilayer ceramics
3. Thin film ceramic circuit board
Based on the combination of LED die and ceramic circuit board: gold wire, but the gold wire connection limits the efficiency of heat dissipation along the electrode contacts, so it encounters a heat dissipation bottleneck.